OpenOpportunity 2023-NIST-CHIPS-SMME-01

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

National Institute of Standards and Technology · Department of Commerce

At a glance

CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment is an open federal cooperative agreement opportunity from the National Institute of Standards and Technology (Department of Commerce). Applications are due November 1, 2026. Applicant types listed as eligible include others (see notice). Cost sharing is not required. It is funded under Assistance Listing 11.037 (CHIPS Incentives Program).

Summary assembled from the official notice's fields. The official notice governs.

Key facts

Posted: Sep 29, 2023
Close date: Nov 1, 2026
Archive date: Dec 1, 2026
Award floor: Not specified
Award ceiling: Not specified
Est. total funding: Not specified
Expected awards: Not specified
Cost sharing: Not required
Funding instrument: Cooperative Agreement
Opportunity category: Discretionary

Who can apply

Others (see notice)

Additional information on eligibility (from the notice)

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Based on the published notice. Review the official notice for complete eligibility requirements.

What it funds

Official synopsis as published by the agency, formatted for readability.

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

Additional information from the agency ↗

Assistance Listing

What is an ALN?

11.037CHIPS Incentives ProgramProgram →

Reported obligations under ALN 11.037

Historical data · not a prediction

FY21

—

FY22

—

FY24

$721M est.

FY25

$90.3M est.

Source: SAM.gov Assistance Listing 11.037. Program-wide totals, not awards from this specific opportunity.

Agency contact (as published)

Misty L Roosa Management Analyst
apply@chips.gov
301-975-3007

Quick answers

When is the deadline for this opportunity?

According to the official notice, applications are due November 1, 2026. Confirm the deadline and submission time on Grants.gov before applying.

Who is eligible to apply for this opportunity?

The official notice lists these applicant types as eligible: Others (see notice). Additional restrictions may apply; review the full notice.

How do I apply for this opportunity?

Applications are submitted through the official source, not through GrantsJunction. Open the official notice on Grants.gov (opportunity 2023-NIST-CHIPS-SMME-01), and review the full announcement and application package. Organizations applying through Grants.gov generally need an active SAM.gov registration and a Grants.gov account, which can take several weeks to set up.

Matched on shared Assistance Listings, agency, categories and eligible applicant types.

OpenALN 11.431